The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 1976
Filed:
Apr. 28, 1971
Applicant:
Inventors:
Tomisaburo Okumura, Kyoto, JA;
Takatoshi Matsuo, Kyoto, JA;
Assignee:
Matsushita Electronics Corporation, Osaka, JA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 34 ; 357 35 ; 357 65 ; 357 67 ; 357 68 ;
Abstract
A high-frequency transistor of planar structure having emitter and base regions of extremely fine structure to reduce the junction capacity. For the wire bond connection between said emitter or base region and an external lead wire, the transistor has the aluminium electrodes which swell and extend on the insulating film.
Okumura, Tomisaburo. (1976). Semiconductor device having bonding pads extending over active regions (U.S. Patent No. 3973271). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/3973271
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile