The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1976
Filed:
Oct. 21, 1974
Keiichi Kuniya, Hitachi, JA;
Tomio Iizuka, Ibaraki, JA;
Masateru Suwa, Hitachi, JA;
Tomio Yasuda, Hitachi, JA;
Takeshi Sasaki, Hitachi, JA;
Sakae Kikuchi, Takasaki, JA;
Hideo Suzuki, Katsuta, JA;
Hitachi, Ltd., , JA;
Abstract
A semiconductor device comprising a semiconductor substrate and a supporting electrode disposed at least on one surface of the semiconductor substrate, in which the supporting electrode has such a composite structure that fibers having a coefficient of thermal expansion substantially equal to or lower than that of the semiconductor substrate are embedded in a matrix of a metal having electric and heat conductivities higher than those of the fibers. This supporting electrode has a satisfactorily high heat conductivity and the coefficient of thermal expansion thereof is freely adjustable.