The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1976
Filed:
Dec. 26, 1974
Applicant:
Inventors:
Soji Takahashi, Kodaira, JA;
Hiroshi Okada, Kodaira, JA;
Assignees:
Hitachi Electronics, Ltd., BOTH OF, JA;
Hitachi, Ltd., BOTH OF, JA;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21C / ; B21C / ; H01P / ;
U.S. Cl.
CPC ...
72 47 ; 29DI / ; 29600 ; 72258 ; 72267 ; 72700 ;
Abstract
A method of manufacturing low energy-loss waveguide circuit elements in which a film of metal with a low resistivity is joined to a base metal by thermal pressing or electric plating, and a hard male die of a desired shape is pressed into the base metal from above the metal film, whereby a plastic strain is caused in the base metal thereby to form a recessed portion in the base metal having an internal surface covered with the low resistivity metal.