Selective plating apparatus

Abstract

Apparatus for continuous electroplating of selected portions of discrete electronic components. The components are carried by a conveyor belt through an electroplating station where the portions to be plated make contact with a moving porous applicator surface wetted with the electroplating solution, while a D.C. potential is suitably applied. A stationary guide at the electroplating station accurately spaces the components with respect to the applicator, and restrains the components fron undesired wobble or vertical movements. The discrete components include leads which are connected to electrically isolated terminals on the die-receiving face of the component. In order to assure effective plating, an electrical potential must be provided to both the die-receiving face and the isolated terminals. The conveyor belt is accordingly electrically conductive and has spaced openings for receiving the component bodies in nesting relationship; and lead contact means are provided which are electrically continuous with the conveyor belt and abound each opening, as to surround the group of leads extending from the nested component and effect a ring-like contact with said group to provide electrical continuity between the leads and conductive conveyor belt. An insulating belt sandwiches, and thereby retains the components in their nested positions, to, in turn, maintain the achieved electrical continuity.