The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 1976

Filed:

Nov. 20, 1973
Applicant:
Inventors:

Tadao Suzuki, Tokyo, JA;

Hirohito Kawada, Chofu, JA;

Yasuo Sugimoto, Musashino, JA;

Assignee:

Sony Corporation, Tokyo, JA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F24H / ;
U.S. Cl.
CPC ...
165129 ; 165 80 ; 317100 ; 357 82 ;
Abstract

A heat dispersion device for use in an apparatus having at least one heat-generating electronic element, such as, a power transistor, includes a thermally conductive heat dispersion member having a portion on which the heat-generating electronic element is mounted and a set of fins defining channels therebetween opening at the top and bottom of the set of fins, and a duct extending upwardly from the set of fins and communicating with the channels between the latter so that the generated heat is dispersed to air flowing upwardly in the channels and the heated air is conducted upwardly in the duct away from the heat dispersion member. For maximum effectiveness, the distance from the bottom of the set of fins to the top of the duct is made at least twice as large as the distance between the top and bottom of the set of fins. Further, the heat dispersion device may include a plurality of heat dispersion members, as aforesaid, assembled together with one or more ducts to provide a required heat dispersing capacity.


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