The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1976
Filed:
Feb. 26, 1975
Applicant:
Inventors:
George Allan Swartz, Plainsboro, NJ (US);
Richard Earl Chamberlain, Yardley, PA (US);
Assignee:
RCA Corporation, New York, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
29577 ; 29578 ; 29580 ; 357 45 ; 357 56 ;
Abstract
An improved method of manufacturing a semi-conductor device having a lead bonded to a surface thereof, wherein the device is fabricated by removing a section of a substrate which surrounds a surface portion of the substrate comprising the surface to which the lead is bonded, includes bonding the lead to the surface portion of the substrate prior to removing the section.
Swartz, George. (1976). Method of manufacturing a semiconductor device having a lead bonded to a (U.S. Patent No. 3956820). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/3956820
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile