The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 1976

Filed:

Dec. 30, 1974
Applicant:
Inventors:

Kuninori Imai, Kanagawa, JA;

Akihiko Higurashi, Tokyo, JA;

Assignees:

Hitachi Electronics, Ltd., BOTH OF, JA;

Hitachi, Ltd., BOTH OF, JA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
29600 ; 72258 ;
Abstract

A method of manufacturing low energy-loss waveguide circuit elements in which a film of metal with low resistivity is laid on the surface of a base metal and a hard metal die of a desired shape is pressed into the base metal through the metal film, so that a plastic strain is caused in the base metal thereby to form a recessed portion in the base metal, while at the same time welding the metal film to the base metal to cover the internal surface of the recessed portion with the metal film.


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