The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 1976

Filed:

Dec. 30, 1974
Applicant:
Inventor:

Alan Raymond Moore, Aldridge, EN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J / ; H01L / ;
U.S. Cl.
CPC ...
29583 ; 29590 ; 83-7 ; 156-6 ; 156 17 ;
Abstract

To manufacture semi-conductor devices an etchant resistant material is applied to the major surfaces of a semi-conductor wafer having at least one n-type zone and at least one p-type zone. The wafer is then divided into individual devices by sawing or scribing part of the way through the wafer and then cracking the wafer along the grooves defined by the sawing or scribing operation, p-n junctions being exposed at the divided edges of the devices. The devices are then mounted on an etchant resistant, adhesive tape with one major surface of each device being presented to the tape, and the tape, with the devices carried thereby, is immersed in an etchant so that the divided edges of the devices are etched.


Find Patent Forward Citations

Moore, Alan. (1976). Method of manufacturing semi-conductor devices (U.S. Patent No. 3953919). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/3953919

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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