The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1976
Filed:
Mar. 29, 1974
Mituo Matunami, Izumisano, JA;
Sharp Kabushiki Kaisha, Osaka, JA;
Abstract
The present disclosure is directed toward a method for making semiconductor devices having beam leads for electrical connections to external terminals. An undercoating metal film is deposited directly or via a protective film on a semiconductor wafer on which interconnections are formed together with electrode pad or contact areas. After subsequent deposition of an upper metal film, beam leads are formed in a desired pattern in a manner to contact with and extend from the electrode areas. The final step is to apply physical force to the semiconductor wafer such that the undercoating metal film serving also as a portion of the beam leads is forcibly spaced away from the major surface of the semiconductor wafer.