The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 1976
Filed:
May. 02, 1974
John Thomas Kenney, Lawrence Township, Mercer County, NJ (US);
Western Electric Company, Inc., New York, NY (US);
Abstract
A method of depositing a metal on a surface of a substrate is disclosed. A surface of the substrate is sensitized with a photosensitive sensitizer comprising a photosensitive species of (1) an element selected from Ni, Mn, U, Mo and W, or (2) a combination of elements comprising Pd and an element selected from In and Ce. The sensitized surface is exposed to a suitable source of radiation, e.g., ultraviolet radiation, to delineate a surface pattern, corresponding to a desired metal pattern, containing a species of at least one selected element which is either (1) capable of reducing an activation metal ion to catalytic activating metal or (2) capable of being reduced to a catalytic activating metal such as catalytic palladium. The ultraviolet radiation-delineated surface pattern is then exposed or treated with a solution comprising an activating metal ion to reduce and deposit thereon an activating metal. The deposited activating metal pattern is then exposed, as by immersion, to a suitable electroless metal deposition solution wherein an electroless metal is catalytically reduced on the activating metal pattern. However, where Pd-In, Pd-Ce sensitizers are employed, exposure to an activating metal ion containing solution is unnecessary and the delineated surface pattern is directly exposed to the electroless metal deposition solution.