The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1976

Filed:

Mar. 21, 1974
Applicant:
Inventor:

Cecil A Lasch, Jr, Cupertino, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D / ;
U.S. Cl.
CPC ...
432 11 ; 165 65 ; 214 / ; 302 / ; 302 29 ; 302 31 ; 432 80 ; 432121 ;
Abstract

An improved apparatus and method for transferring articles, such as silicon and like wafers used in making electronic devices from one station to another at variable rates of movement utilizing a fluid bearing. The apparatus and method also provide for heat treating the wafers in a furnace through which the fluid bearing extends. The fluid bearing track structure utilized is produced from a refractory, heat-resistant material, such as quartz or silicon carbide, and comprises an enclosed tube having fluid bearing passages through the base wall thereof in communication with fluid supply means. The track structure is operatively divided into at least two track sections positioned as linear continuations of each other. Article receiving means for automatically feeding articles in sequence from a supply thereof and for accepting articles in sequence following completion of treatment thereof are provided at the stations between which the wafers are transferred. Such means includes automatically indexable magazines for discharging and receiving wafers in sequence. The fluid bearing apparatus and method is constructed to rapidly accelerate slow moving or stopped wafers in sequence onto means for rapidly cooling the wafers after heat treatment so that rapid and uniform quenching may be effected and uniform results insured.


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