The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1976
Filed:
Sep. 17, 1974
Applicant:
Inventors:
Shinzo Anazawa, Tokyo, JA;
Seiichi Ueno, Tokyo, JA;
Isamu Nagasako, Tokyo, JA;
Tadashi Nawa, Tokyo, JA;
Toshiaki Irie, Tokyo, JA;
Shigeru Sando, Tokyo, JA;
Assignee:
Nippon Electric Company, Limited, Tokyo, JA;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 81 ; 357 84 ;
Abstract
A semiconductor package device characterized by improved operation at ultra-high frequencies and by improved heat dissipation, includes an auxiliary metal stud mounted on a metal substrate. A semiconductor element, such as a field-effect transistor or bipolar transistor, is mounted on the auxiliary stud and has at least one electrode thereof electrically connected to the stud.