The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1976
Filed:
Oct. 16, 1973
Toyoki Takemoto, Kyoto, JA;
Hiroshi Kuroda, Katano, JA;
Matsushita Electric Industrial Co., Ltd., Kadoma, JA;
Abstract
In a method of making integrated circuits, prior to vapor deposition of metal layers on an insulating layer for interconnection, each opening on the insulating layer is filled with an embedded metal layer in order to smoothen the surface to be vapor deposited and to avoid undesirable thin parts of the vapor deposited metal layer at the step between the lower part in the opening and the elevated part on the insulating layer. The filling of the embedded metal layer in each opening is made by a first step of coating a metal layer on the whole surface of the principal face of the semi-conductor, which surface is coated by the insulating layer with specified openings and further by a photoresist layer which has been used for etching the insulating layer to form said openings and is left covering said insulating layer, and by the subsequent step of applying a photoresist removing liquid on the face to remove the photoresist layer and the part of metal layer still remaining on the photoresist layer.