The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 1976

Filed:

Aug. 23, 1974
Applicant:
Inventors:

Gerald C Smith, Sidney, NY (US);

Dennis L Ellingson, Sidney, NY (US);

Colin A Johnson, Sidney, NY (US);

Seong K Rhee, Livonia, MI (US);

Assignee:

The Bendix Corporation, Southfield, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
219 85 ; 156583 ; 165185 ; 219229 ; 228 54 ;
Abstract

A bonding head for connecting the electrically conductive leads of a tape cable or the like to other electrical conductors. The bonding head, which applies heat and pressure to the electrical conductors and leads to bond them together, is an elongated member comprised of a material having high mechanical strength but low thermal conductivity which contains a conduit comprised of a material having low mechanical strength but high thermal conductivity. A heating element inserted in the conduit supplies heat to the conduit and bonding head. This arrangement provides a bonding head having a high mechanical strength and hence structural failure and deformation of the bonding head is reduced.


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