The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1976
Filed:
Feb. 28, 1974
Applicant:
Inventors:
Yoshiaki Wakashima, Kawasaki, JA;
Hiroshi Suzuki, Hitachi, JA;
Assignee:
Hitachi, Ltd., , JA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 252511 ; 252300 ; 174 / ; 427 82 ;
Abstract
In sealing at least a semiconductor element portion of a semiconductor device by the use of a resin, the semiconductor element is covered with a stabilizer or with a resin containing the stabilizer. The stabilizer is adapted to check the migration of a mobile substance such as hydrochloric acid and a mobile ion such as chlorine ion existent within the resin. Owing to the fixation of the ion, the electrical characteristics of the semiconductor device are prevented from being degraded, and constituent parts in the semiconductor device are prevented from being corroded.