The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 1976
Filed:
Oct. 15, 1974
Josuke Nakata, Itami, JA;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JA;
Abstract
A cylindrical substrate of semiconductive material is repeatedly incised by a saw to be formed with many parallel grooves while it has one portion of the peripheral portion remaining uncut throughout its length. Thus, the grooves define between them many parallel wafer units integrally interconnected through the uncut portion. Then all the wafer units are simultaneously cleaned, diffused with an impurity, etched, and so on. After the completion of all the simultaneous processing operations, the wafer units are removed from the uncut portion to form separate wafers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile