The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1976
Filed:
Jun. 21, 1974
Hiroshi Narui, Uji, JA;
Terumi Shinohara, Joyo, JA;
Oike & Company, Ltd., Kyoto, JA;
Abstract
A process for providing a margin in a metallized resin film for a condenser element which is characterized by providing on a dielectric resinous layer a water-soluble coating layer having a pattern corresponding to a margin pattern, providing a metal deposition layer on the resinous layer including a coated part and a non-coated part and removing the water-soluble coating layer and the metal deposition layer thereon by washing with water. According to the process, a metallized resin film having an arbitrary margin pattern and a superior electrical property can be readily obtained, with completely eliminating any complexity of the procedure and disadvantage in conventional processes for providing a margin.