The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1976
Filed:
Oct. 10, 1974
Applicant:
Inventors:
Gert Siegle, Hildesheim, DT;
Hans Lutz, Stuttgart, DT;
Helmut Adam, Stuttgart, DT;
Erhard Gossl, Gerlingen, DT;
Assignee:
Robert Bosch G.m.b.H., Stuttgart, DT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; H01L / ;
U.S. Cl.
CPC ...
204192 ; 29590 ;
Abstract
Copper is sputtered onto a substrate to make a solder-fast contact layer by carrying out the sputtering in a discharge of a monatomic gas containing 0.5 to 16% of air, nitrogen or oxygen which reduces the conductivity of the copper layer, but makes it resistant to alloying with a solution in solder, to an extent comparable with the results obtained by the provision of intermediate diffusion barrier layers. Best results are obtained in an argon discharge in the presence of an admixture of nitrogen or air between 2 and 4% by volume. The solder-wetting properties are not impaired.