The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Oct. 17, 2023
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Felix Stewing, Steinheim, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/135 (2006.01); H10D 84/01 (2026.01); H10W 40/22 (2026.01); H10W 70/60 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H02M 3/135 (2013.01); H10D 84/01 (2025.01); H10W 40/226 (2026.01); H10W 70/60 (2026.01); H10W 70/611 (2026.01);
Abstract

A semiconductor module. The semiconductor module includes: at least one semiconductor switch and a capacitor component, wherein the capacitor component has a lateral finger structure and includes a semiconductor substrate, at least two first electrodes, at least two second electrodes. The first electrodes and the second electrodes respectively have identical basic forms and are formed alternatingly next to one another at a predefined distance within and/or on the semiconductor substrate and are configured to be contacted individually from outside the capacitor component via respective contacting regions. At least a portion of the first electrodes and of the second electrodes is electrically connected via respective contacting regions of the capacitor component to respective contacting regions of the semiconductor switch, and the capacitor component and the semiconductor switch are integrated into the semiconductor module.


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Stewing, Felix. (2026). Semiconductor module (U.S. Patent No. 12796564). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796564

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