The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jan. 16, 2024
Mediatek Singapore Pte. Ltd., Singapore, SG;
MEDIATEK SINGAPORE PTE. LTD., Singapore, SG;
Abstract
A semiconductor package structure includes a first redistribution layer, a capacitor structure, and a second redistribution layer. The capacitor structure is disposed over the first redistribution layer and includes a semiconductor substrate, a first capacitor cell, a second capacitor cell, and a through via. The first capacitor cell and the second capacitor cell are disposed over the semiconductor substrate and separated by a first scribe line region. The through via is disposed in the first scribe line region. The second redistribution layer is disposed over the capacitor structure and is electrically coupled to the first redistribution layer through the through via.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile