The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jun. 26, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kil Soo Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package and method of fabricating the same are provided. The semiconductor package includes a first semiconductor chip including first and second surfaces opposite to each other; connection terminals on the first surface of the first semiconductor chip; a first dielectric layer on the second surface of the first semiconductor chip; a second semiconductor chip on the first dielectric layer and including a third surface opposite to the second surface and a fourth surface opposite to the third surface; a second dielectric layer on the third surface of the second semiconductor chip and in contact with the first dielectric layer; a third semiconductor chip on the fourth surface of the second semiconductor chip; and a first adhesive layer between the second semiconductor chip and the third semiconductor chip, the first dielectric layer and the second dielectric layer including no wirings.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile