The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
May. 11, 2023
Skyworks Solutions, Inc., Irvine, CA (US);
Lichuan Chen, Thousand Oaks, CA (US);
SKYWORKS SOLUTIONS, INC., Irvine, CA (US);
Abstract
Disclosed is a localized shield to protect integrated circuit (IC) components within a package module from electromagnetic interference (EMI). Conventional EMI shielding solutions, such as a compartment shield, protect an entire package but do not provide localized protection or grounding of IC components. To construct the EMI shield disclosed herein, a layer of conductive epoxy is deposited on an upper conductive surface of the IC component, then the component is encapsulated in mold compound. Excess mold compound is ground down to expose the epoxy layer, and a conformal shield layer is applied over the mold compound such that the conductive epoxy layer forms a ground path between the conformal shield and the conductive surface of the IC component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile