The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Mar. 03, 2023
Applicant:
Mitsui High-tec, Inc., Fukuoka, JP;
Inventor:
Ryota Furuno, Fukuoka, JP;
Assignee:
Mitsui High-tec, Inc., Fukuoka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01);
U.S. Cl.
CPC ...
H10W 70/427 (2026.01); H10W 70/411 (2026.01);
Abstract
A lead frame including: a die pad; a lead arranged at a periphery of the die pad; and a support bar supporting the die pad, in which the support bar has, at one principal surface thereof, a covered portion covered with needle-like oxide and an exposed portion not covered with the needle-like oxide, and the exposed portion is formed at a bent portion of the support bar inclined with respect to the lead as viewed laterally.
Quick Actions:
Furuno, Ryota. (2026). Lead frame and method for manufacturing lead frame (U.S. Patent No. 12796484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796484
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile