The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Feb. 02, 2024
Realtek Semiconductor Corporation, Hsinchu, TW;
Kai-Yen Chang, Hsinchu, TW;
REALTEK SEMICONDUCTOR CORPORATION, Hsinchu, TW;
Abstract
An IC package structure includes a die, a die pad, a downbond wire, a lead frame, and bonding wires. The die includes: a first interference source and a second interference source being coupled with a first signal pad and a second signal pad respectively; and a first grounding pad and a second grounding pad being coupled together and positioned between the two interference sources. The die pad holds the die. The downbond wire couples the second grounding pad with the die pad's grounding terminal. The lead frame includes: a first lead; a second lead; and M grounding lead(s) positioned between the first and second leads. The bonding wires include: a first bonding wire coupling the first signal pad with the first lead; a second bonding wire coupling the second signal pad with the second lead; and N third bonding wire(s) coupling the first grounding pad with the M grounding lead(s).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile