The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Dec. 18, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Keiji Matsumoto, Yokohama, JP;

Mukta Ghate Farooq, Hopewell Junction, NY (US);

John Knickerbocker, Monroe, NY (US);

John W Golz, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/685 (2026.01); H10W 40/22 (2026.01); H10W 40/25 (2026.01); H10W 70/695 (2026.01); H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 74/15 (2026.01);
U.S. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 40/228 (2026.01); H10W 70/685 (2026.01); H10W 70/695 (2026.01); H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract

Semiconductor packaging structures are provided in which a graphite sheet is used for thermal conduction of heat generated by a semiconductor chip to a foot of a heat spreader that is thermally connected to the graphite sheet. The graphite sheet can be present in a frontside laminate or in an upper portion of frontside build-up layers of an organic substrate core.


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Matsumoto, Keiji. (2026). Semiconductor packaging structure with graphite sheets (U.S. Patent No. 12796463). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796463

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