The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Nov. 03, 2021
Siemens Aktiengesellschaft, Munich, DE;
Stefan Pfefferlein, Heroldsberg, DE;
Felix Zeyss, Erlangen, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A semiconductor module includes a semiconductor element having a first side in contact with a first substrate in a planar manner, and a second side which faces away from the first side and contacts a metallic heat sink in a planar manner. The heat sink is in thermally conductive connection with the semiconductor element and connected to the second substrate in an electrically conductive manner. The heat sink includes a main body for planar contacting of the semiconductor element and a fin arranged in a recess of the second substrate. The second substrate is connected in an electrically conductive manner to the main body which has a circumferential contact surface around the fin to establish a material-bonded connection with a substrate metallization of the second substrate. The circumferential contact surface is arranged on a side of the main body facing away from the semiconductor element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile