The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Feb. 23, 2023
Robert Bosch Gmbh, Stuttgart, DE;
Bernhard Polzinger, Stuttgart, DE;
Christian Foerster, Reutlingen, DE;
Jens Buettner, Reutlingen, DE;
Kristina Vogt, Muenchingen, DE;
ROBERT BOSCH GMBH, Stuttgart, DE;
Abstract
A method for manufacturing a carrier substrate on a semiconductor wafer that includes a front side and a rear side, the front side being situated opposite the rear side, the front side representing a structured semiconductor wafer side including contact areas. The method includes the following steps: applying at least one first layer to the front side with the aid of printing technology, the at least one first layer including a first material that is water-insoluble, and curing the at least one first layer with the aid of UV radiation, thermally or with the aid of sintering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile