The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Aug. 28, 2023
Applicant:

Ii-vi Delaware, Inc., Wilmington, DE (US);

Inventors:

Jonathan Coppola, Wilmington, DE (US);

Nicholas Coombs, Wilmington, DE (US);

Jiwen Wang, Wilmington, DE (US);

Mike Aghajanian, Wilmington, DE (US);

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/78 (2026.01); C04B 35/52 (2006.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/78 (2026.01); C04B 35/52 (2013.01); H10P 72/7614 (2026.01); H10P 72/7624 (2026.01); C04B 2235/3826 (2013.01); C04B 2235/427 (2013.01);
Abstract

A reaction-bonded silicon carbide body includes a main body portion free of diamond and one or more discrete elements each formed from a single diamond particle embedded within the main body. The discrete elements may be machined into pins that project from the body for supporting a semiconductor wafer in a vacuum wafer chuck. By localizing diamond only within the discrete elements, the body provides high thermal conductivity and wear resistance where needed while maintaining machinability and reducing cost.


Find Patent Forward Citations

Quick Actions:

Coppola, Jonathan. (2026). Vacuum wafer chuck with solid diamond pins (U.S. Patent No. 12796399). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796399

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