The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Apr. 16, 2024
Applicant:

Stanley Electric Co., Ltd., Tokyo, JP;

Inventors:

Takuma Yajima, Tokyo, JP;

Yusaku Fujii, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/81 (2025.01); H10H 20/01 (2025.01); H10H 20/813 (2025.01); H10H 20/854 (2025.01);
U.S. Cl.
CPC ...
H10H 20/81 (2025.01); H10H 20/0133 (2025.01); H10H 20/8131 (2025.01); H10H 20/854 (2025.01); H10H 20/0362 (2025.01);
Abstract

A light emitting element includes an element main body and a sapphire substrate. The element main body has an AlGaAs-based semiconductor layer, an n-type current diffusion layer, and a cap layer of an InGa-based semiconductor that does not contains As as a component in a lamination direction. The amorphous layer is interposed between the element main body and the sapphire substrate, and contains constituent elements of the cap layer and the sapphire substrate as components.


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Yajima, Takuma. (2026). Light emitting element bonded to a light trasmitting plate and manufacturing method (U.S. Patent No. 12796168). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796168

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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