The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Dec. 27, 2023
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Rina Takeda, Settsu, JP;

Yuta Saito, Settsu, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/804 (2025.01); H10F 39/811 (2025.01);
Abstract

An optical semiconductor device includes a semiconductor substrate provided with a light-receiving element, a frame-shaped rib member, and a transparent substrate in this order, and an adhesive layer bonding the rib member and the semiconductor substrate to each other. The rib member and the adhesive layer are provided so as to surround the light-receiving element. In the optical semiconductor device, the adhesive layer protrudes outward from an outer peripheral surface of the rib member when the rib member and the adhesive layer are viewed from a transparent substrate side. A coverage ratio of the adhesive layer on an inner peripheral surface of the rib member is 30% or less.


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Takeda, Rina. (2026). Optical semiconductor device (U.S. Patent No. 12796132). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796132

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