The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Feb. 04, 2022
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
The present technology relates to a semiconductor chip, a method for manufacturing the same, and an electronic device that can improve reliability and durability. The semiconductor chip includes a solid-state imaging element such as a complementary metal oxide semiconductor (CMOS) image sensor (CIS), a glass substrate provided on the solid-state imaging element, and a lens formed on the glass substrate. The glass substrate has a groove having a depth of L1-L2 around a region where the lens is formed. The present technology can be applied, for example, to a semiconductor chip or the like that is a wafer level chip size package (WCSP) having a solid-state imaging element such as a CIS.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile