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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12796085 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Aug. 23, 2022

Wiring board and method for manufacturing the same, functional backplane, backlight module, display module and display apparatus

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Nianqi Yao, Beijing, CN;

Yingwei Liu, Beijing, CN;

Guangcai Yuan, Beijing, CN;

Ce Ning, Beijing, CN;

Zhengliang Li, Beijing, CN;

Zhanfeng Cao, Beijing, CN;

Ke Wang, Beijing, CN;

Kun Zhao, Beijing, CN;

Qi Qi, Beijing, CN;

Assignee:

Beijing BOE Technology Development Co., Ltd., Beijing, CN;

Attorney:

The Webb Law Firm

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H10K 59/82 (2023.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 29/49 (2025.01); H10H 29/80 (2025.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10H 29/49 (2025.01); H10H 29/8322 (2025.01); H10K 59/1315 (2023.02); H10K 59/80517 (2023.02); H10K 59/82 (2023.02);
Abstract

A wiring board includes a base substrate, an active pattern layer, and an electrical pattern layer. The active pattern layer is arranged on a side of the base substrate and includes a plurality of active patterns. The electrical pattern layer is arranged on a side of the active pattern layer away from the base substrate, and includes a plurality of connection portions, and at least one connection portion is coupled to an active pattern. A connection portion includes a plurality of first sub-layers which are stacked arranged in a thickness direction of the base substrate, two first sub-layers are farthest away from the base substrate among the plurality of first sub-layers are a first conductive sub-layer and a first protective sub-layer. The first protective sub-layer is arranged on a side of the first conductive sub-layer away from the base substrate, and the material of the first protective sub-layer includes nickel.

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Yao, Nianqi. (2026). Wiring board and method for manufacturing the same, functional backplane, backlight module, display module and display apparatus (U.S. Patent No. 12796085). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796085

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