The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Aug. 04, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Younghun Seong, Suwon-si, KR;
Bumhee Bae, Suwon-si, KR;
Euisung Kang, Suwon-si, KR;
Hyeonhak Kim, Suwon-si, KR;
Kanghyun Ryoo, Suwon-si, KR;
Jaehoon Lee, Suwon-si, KR;
SAMSUNG ELECTRONIC CO., LTD., Gyeonggi-Do, KR;
Abstract
An electronic device can include a hinge structure; a flexible display which is folded or unfolded by the hinge structure; a first portion and a second portion which are close to and facing each other when folded by the hinge structure, and spaced apart when unfolded; a first circuit board disposed on the first portion; a second circuit board disposed on the second portion; and a flexible circuit board electrically connecting the first printed circuit board and the second circuit board. The flexible printed circuit board includes a first area which bends in response to the deformation of the electronic device, and a second region positioned around the first region that does not bend. The first region may include a single main signal wiring layer. The second portion may include a plurality of signal wiring layers. The first region and the second region may be formed to have different thicknesses.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile