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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12795832 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Feb. 21, 2022

Wiring board and manufacturing method thereof, and functional backplane

Applicants:

Boe Mled Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Chao Liu, Beijing, CN;

Ting Cai, Beijing, CN;

Ming Zhai, Beijing, CN;

Lili Wang, Beijing, CN;

Jing Wang, Beijing, CN;

Mingming Jia, Beijing, CN;

Sha Feng, Beijing, CN;

Enkai Dong, Beijing, CN;

Haiwei Sun, Beijing, CN;

Ke Wang, Beijing, CN;

Assignees:

BOE MLED TECHNOLOGY CO., LTD., Beijing, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorney:

XSENSUS LLP

Primary Examiner:

Paresh Paghadal

Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/0296 (2013.01); H05K 1/117 (2013.01); H05K 3/36 (2013.01); H10W 70/05 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 90/401 (2026.01); H05K 2201/041 (2013.01); H10W 90/00 (2026.01);
Abstract

A wiring board assembly includes a mother board and a daughter board that are stacked, a bonding layer disposed between the mother board and the daughter board, and at least one side wiring. The mother board includes a first substrate, and a first wiring layer disposed on the first substrate and including at least one first connection pad. The daughter board is disposed on a side of the first substrate away from the first wiring layer. The daughter board includes a second substrate, and a second wiring layer disposed on the second substrate and including at least one second connection pad. The at least one side wiring is connected, via a respective end thereof, to the at least one first connection pad in one-to-one correspondence, and the at least one side wiring is connected, via respective another end thereof, to the at least one second connection pad in one-to-one correspondence.

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Liu, Chao. (2026). Wiring board and manufacturing method thereof, and functional backplane (U.S. Patent No. 12795832). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12795832

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