The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Jul. 17, 2024
Applicant:
Dell Products L.p., Round Rock, TX (US);
Inventors:
Chang-Hsien Chen, New Taipei City, TW;
Yi-Tang Chen, Xinzhuang, TW;
Chun-Lin Liao, Taipei, TW;
Bhyrav Mutnury, Round Rock, TX (US);
Assignee:
Dell Products L.P., Round Rock, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0242 (2013.01); H05K 3/382 (2013.01); H05K 2201/0929 (2013.01); H05K 2203/0307 (2013.01);
Abstract
Copper foil to provide electrical conductivity includes a flexible conductive surface on which multiple roughness nodules are formed, arranged according to a predetermined pattern. One or more channels extend between a pair of rows of the roughness nodules, each channel provides a conduction path.
Quick Actions:
Chen, Chang-Hsien. (2026). Copper foil having patterned roughness nodules (U.S. Patent No. 12795814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12795814
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile