The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2026
Filed:
Nov. 16, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Kosuke Urashima, Tokyo, JP;
Motoki Yonekura, Tokyo, JP;
Motohiro Arifuku, Tokyo, JP;
Tomohiko Kotake, Tokyo, JP;
Etsuo Mizushima, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H05K 3/06 (2013.01); H05K 3/28 (2013.01); H05K 2201/0753 (2013.01); H05K 2201/083 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/063 (2013.01);
Abstract
A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.
Quick Actions:
Urashima, Kosuke. (2026). Wiring substrate (U.S. Patent No. 12795811). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12795811
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile