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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12790520 B1

PDFFull Text
Date of Patent:
Nov. 10, 2026

Filed:

Feb. 08, 2019

Pressure-sensitive adhesive compositions for electronic bonding applications

Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Pierre R. Bieber, Dusseldorf, DE;

John W. Mcallister, St. Paul, MN (US);

Benjamin J. Bending, St. Paul, MN (US);

Zhong Chen, Woodbury, MN (US);

Vasav Sahni, St. Paul, MN (US);

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);

Attorney:

Kathleen B. Gross

Primary Examiner:

Anish P Desai

Int. Cl.
CPC ...
C09J 7/35 (2018.01); C08K 5/32 (2006.01); C08L 45/02 (2006.01); C08L 47/00 (2006.01); C08L 93/04 (2006.01); C09J 7/38 (2018.01); C09J 123/22 (2006.01);
U.S. Cl.
CPC ...
C09J 7/383 (2018.01); C08K 5/32 (2013.01); C08L 45/02 (2013.01); C08L 47/00 (2013.01); C08L 93/04 (2013.01); C09J 7/35 (2018.01); C09J 123/22 (2013.01); C08L 2203/206 (2013.01); C08L 2312/00 (2013.01); C09J 2203/326 (2013.01); Y10T 428/2883 (2015.01);
Abstract

The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

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Quick Actions:

Bieber, Pierre. (2026). Pressure-sensitive adhesive compositions for electronic bonding applications (U.S. Patent No. 12790520). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12790520

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