The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jul. 24, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongkyu Kim, Suwon-si, KR;
Kyung Don Mun, Suwon-si, KR;
Kyoung Lim Suk, Suwon-si, KR;
Hyeonjeong Hwang, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Disclosed is a semiconductor package comprising a lower circuit part having a first region and a second region horizontally offset from each other and including a connection structure within the first region and a logic chip within the second region, a memory structure that overlaps the connection structure in a vertical direction, and a thermal radiation structure that overlaps the logic chip in the vertical direction. The logic chip and the memory structure are spaced apart in a horizontal direction parallel to a top surface of the logic chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile