The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Sep. 22, 2022
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Heng Li, Shanghai, CN;

Xiaodong Zhang, Shenzhen, CN;

Tonglong Zhang, Shenzhen, CN;

Simin Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 20/20 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 20/20 (2026.01); H10W 74/01 (2026.01); H10W 74/137 (2026.01); H10W 72/01208 (2026.01); H10W 72/01235 (2026.01); H10W 72/01257 (2026.01); H10W 72/248 (2026.01); H10W 72/252 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01);
Abstract

This disclosure provides a chip structure, including a first chip and a first protective layer, where the first protective layer covers a first surface of the first chip; and a first conductive connector is vertically disposed in the first protective layer, the first conductive connector penetrates through an upper surface and a lower surface of the first protective layer, one end of the first conductive connector is electrically connected to the first surface of the first chip, the other end of the first conductive connector is exposed to the first protective layer, and the first protective layer is formed by a material whose modulus is greater than a preset value.


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Li, Heng. (2026). Chip structure and chip preparation method (U.S. Patent No. 12787867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787867

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