The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jun. 29, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Hansol Yoo, Sejong-si, KR;
Wonkeun Kim, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 74/01 (2026.01); B29C 33/68 (2006.01); B29L 31/34 (2006.01); B32B 5/02 (2006.01); B32B 7/06 (2019.01); B32B 27/12 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
H10W 74/017 (2026.01); B29C 33/68 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 7/06 (2013.01); B32B 27/12 (2013.01); B32B 27/304 (2013.01); B29L 2031/3406 (2013.01); B32B 2307/202 (2013.01); B32B 2307/732 (2013.01);
Abstract
A release film may include a conductive polymer substrate layer, and release layers provided on a top surface and a bottom surface of the conductive polymer substrate layer. Each of the release layers may include a fluorine-based polymer, and a density of the conductive polymer substrate layer ranges from 0.1 g/cmto 0.5 g/cm.
Quick Actions:
Yoo, Hansol. (2026). Release film and method of manufacturing semiconductor package using the same (U.S. Patent No. 12787846). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787846
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile