The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Aug. 30, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Hansung Ryu, Suwon-si, KR;
Yongsung Park, Suwon-si, KR;
Jongbeom Park, Suwon-si, KR;
Junho Lee, Suwon-si, KR;
Jihyun Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 72/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/20 (2026.01); H10W 72/223 (2026.01); H10W 72/232 (2026.01); H10W 72/252 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.
Quick Actions:
Ryu, Hansung. (2026). Semiconductor package having a blocking layer on a solder ball (U.S. Patent No. 12787841). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787841
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