The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Sep. 14, 2022
Applicant:
Fasford Technology Co., Ltd., Yamanashi, JP;
Inventors:
Assignee:
FASFORD TECHNOLOGY CO., LTD., Minami-Alps, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/0112 (2026.01); H10W 72/012 (2026.01); H10W 72/01215 (2026.01); H10W 72/01271 (2026.01); H10W 72/07118 (2026.01); H10W 72/07131 (2026.01); H10W 72/07183 (2026.01); H10W 72/072 (2026.01); H10W 90/721 (2026.01);
Abstract
A dipping apparatus includes a squeegee device and a plate for forming a flux film out of flux. A surface of the plate has a rough surface with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to each other, and the flux is fed from the squeegee device to the rough surface of the plate.
Quick Actions:
Lee, Geonju. (2026). Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device (U.S. Patent No. 12787837). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787837
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