The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Apr. 26, 2022
Kyocera Corporation, Kyoto, JP;
KYOCERA CORPORATION, Kyoto, JP;
Abstract
A semiconductor package includes: a base including a first surface including a first side and a second side coupled to the first side; a wiring laminate located on the first surface, extending along the first side of the first surface, and including a second surface extending along the second side; and a peripheral wall portion, together with the wiring laminate, surrounding the first surface. The wiring laminate includes a plurality of insulation layers laminated in a layered structure, at least two first wiring conductors located on different insulation layers of the plurality of insulation layers, and an interlayer conductor located on a side surface and coupling the at least two first wiring conductors to each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile