The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Nov. 30, 2023
Applicant:

Analog Devices, Inc., Wilmington, MA (US);

Inventors:

John David Brazzle, Tracy, CA (US);

Vikas Paduvalli, San Jose, CA (US);

Assignee:

Analog Devices, Inc., Wilmington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); H10W 74/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01); H10W 74/00 (2026.01); H10W 90/732 (2026.01); H10W 90/734 (2026.01); H10W 90/792 (2026.01); H10W 90/794 (2026.01);
Abstract

An electronic assembly is disclosed. The electronic assembly can include a first integrated device package having a first substrate, a plurality of electronic components mounted to the first substrate, a first plurality of vertical interconnects connected to first substrate and extending outwardly, a first molding compound over at least portions of the plurality of electronic components, and an electromagnet connected to the first substrate. The electromagnet can be connected to the plurality of electronic components via one or more electrical connections. The electronic assembly can also include a second integrated device package having a second substrate, a second plurality of vertical interconnects connected to the second substrate, a second molding compound, and electrical terminals formed on a second side of the second substrate. The first and second vertical interconnects can be disposed between the first and second substrates.


Find Patent Forward Citations

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Brazzle, John. (2026). Stacked vertical power module (U.S. Patent No. 12787823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787823

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