The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Oct. 24, 2023
Applicant:

Mosaic Microsystems Llc, Rochester, NY (US);

Inventors:

David Howard Levy, Rochester, NY (US);

Shelby Forrester Nelson, Pittsford, NY (US);

Assignee:

MOSAIC MICROSYSTEMS LLC, Rochester, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/05 (2026.01); C03C 23/00 (2006.01); H10P 50/00 (2026.01); H10W 70/63 (2026.01); H10W 70/692 (2026.01);
U.S. Cl.
CPC ...
H10W 70/095 (2026.01); C03C 23/0025 (2013.01); H10P 50/73 (2026.01); H10W 70/635 (2026.01); H10W 70/692 (2026.01);
Abstract

A method of facilitating formation of a via in an inorganic substrate may include applying a single-sided acidic wet etching process to a first surface of the inorganic substrate in a first state in which the inorganic substrate has a mask layer set covering a second surface of the inorganic substrate; and applying a double-sided acidic wet etching process to the first surface and the second surface of the inorganic substrate after completion of the single-sided acidic wet etching process and in a second state in which the inorganic substrate has had the mask layer set removed from the second surface of the inorganic substrate.


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Quick Actions:

Levy, David. (2026). Facilitating formation of a via in a substrate (U.S. Patent No. 12787797). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787797

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