The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Apr. 23, 2024
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Nicholas Latham, Albany, NY (US);

Nicholas Alexander Polomoff, Hopewell Junction, NY (US);

Kishan Jayanand, Albany, NY (US);

Mukta Ghate Farooq, Hopewell Junction, NY (US);

Ashim Dutta, Clifton Park, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/00 (2026.01); H10W 20/40 (2026.01); H10W 20/44 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/401 (2026.01); H10W 20/4421 (2026.01); H10W 20/498 (2026.01); H10W 90/794 (2026.01);
Abstract

A structure is provided that includes a hybrid bonding interface located between a resistance temperature detector (RTD)-containing structure and a device-containing structure. In such a structure, the RTD-containing structure includes RTD wiring including a first RTD wiring region electrically connected to a RTD resistive element, and a second RTD wiring region electrically connected to the first RTD wiring region. The device-containing structure includes a first electrically conductive interconnect region and a second electrically conductive interconnect region. In the structure, the RTD resistive element is electrically connected to the first electrically conductive interconnect region at the hybrid bonding interface and the second electrically conductive interconnect region is electrically connected to the second RTD wiring region at the hybrid bonding interface.


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Latham, Nicholas. (2026). Resistance temperature detector at hybrid bonding interface (U.S. Patent No. 12787793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787793

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