The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jun. 21, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yongjin Seol, Seongnam-si, KR;
Seonhyang You, Hwaseong-si, KR;
Wonjae Lee, Yongin-si, KR;
Wooik Jang, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a mold layer on the package substrate to cover the semiconductor chip, the mold layer having a first side surface and a first trench disposed at the first side surface, and the first trench extending from a top surface of the mold layer toward a bottom surface of the mold layer, an antenna pattern on the mold layer, and a first connection terminal filling the first trench. The antenna pattern is electrically connected to the package substrate through the first connection terminal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile