The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jun. 24, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Ruey-Bo Sun, Hsinchu City, TW;
Sheng-Mou Lin, Hsinchu City, TW;
Assignee:
MEDIATEK INC., Hsinchu City, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 42/20 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01);
Abstract
According to an embodiment of the invention, a semiconductor device comprises a substrate, a semiconductor die and a first shielding structure. The semiconductor die is disposed on the substrate and comprises an electronic device. The first shielding structure is formed outside of the semiconductor die and disposed under the electronic device.
Quick Actions:
Sun, Ruey-Bo. (2026). Semiconductor devices with in-package pgs for coupling noise suppression (U.S. Patent No. 12787787). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787787
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile