The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 08, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Mihyae Park, Suwon-si, KR;
Chiwoo Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including a first semiconductor chip and a second semiconductor chip on a first substrate, a thermal conductive adhesive layer on the first semiconductor chip and the second semiconductor chip and including a resin layer, the resin layer including a first heat dissipation filler, the first heat dissipation filler including a liquid metal, and the semiconductor package further including a heat dissipation member on the thermal conductive adhesive layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile