The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Mar. 26, 2024
Applicants:

Denso International America, Inc., Southfield, MI (US);

Denso Corporation, Kariya, JP;

Inventors:

Sean Schoneboom, Owosso, MI (US);

Jason Spenny, Berkley, MI (US);

Siddharth Dasgupta, Windsor, CA;

John Vandermeer, Royal Oak, MI (US);

Assignees:

DENSO International America Inc., Southfield, MI (US);

DENSO Corporation, Kariya-city, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01); H10W 40/22 (2026.01); H10W 40/43 (2026.01); H10W 40/47 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H10W 40/228 (2026.01); H10W 40/226 (2026.01); H10W 40/43 (2026.01); H10W 40/47 (2026.01); H10W 74/114 (2026.01); H10W 90/00 (2026.01); H05K 1/0203 (2013.01); H05K 7/209 (2013.01); H05K 2201/066 (2013.01);
Abstract

A power card assembly includes an integrated circuit and an emitter in thermal communication with the integrated circuit. The emitter includes a base portion and a plurality of spaced-apart projections extending from the base portion. In some arrangements, the power card assembly may include multiple integrated circuits, and multiple associated emitters may be employed to increase heat dissipation. The power card assembly structures described operate to minimize the number of thermal interfaces in the power card assembly and facilitate dissipation of heat from the power card assembly.


Find Patent Forward Citations

Quick Actions:

Schoneboom, Sean. (2026). Emitters for integrated power card cooling (U.S. Patent No. 12787767). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787767

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